CHIP CAPACITOR, SENSORS

Part #
Description
DATASHEET
MSDS
2900 Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
2900
2900-MSDS
2900LV Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
2900LV
2900LV-MSDS
2948 Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.
2948
2948-MSDS
6570 A translucent, encapsulating epoxy adhesive
6570
6570-MSDS