CHIP SCALE, BGA, SOLDER REFLOW

Part #
Description
DATASHEET
MSDS
2900 Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, Silver and gold.
2900
2900-MSDS
2900LV Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.
2900LV
2900LV-MSDS
2948 filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.
2948
2948-MSDS
2990 Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.
2990
2990-MSDS
6770 Dielectric epoxy adhesive formulated for attaching surface mounted devices to PC boards prior to wave solder.
6770
6770-MSDS
6771 Surface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200°C Tg = 154°C
6771
6771-MSDS
6900 Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60°C / 80% R.H.
6900
6900-MSDS
6959 Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175°C.
6959
6959-MSDS
6968 Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175°C. Low ionic, no epoxy bleed.
6968
6968-MSDS
6905 Combination underfill and flux for flip chip solder reflow. Solder reflow to 240°C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240°C.
6905
6905-MSDS
6980 Flip chip underfill adhesive
6980
6980-MSDS
7990 Chip scale underfill encapsulant, 1 mil gap. Low mobile ions. Long work life.
7990
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7995 Glob top adhesive. Chip-on-board encapsulant. High purity. Maximum moisture resistance. Low mobile ions, Tg=132°C
7995
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