ELECTRICAL GROUNDING

Part #
Description
DATASHEET
MSDS
2072 Silver filled, snap cure, low outgassing epoxy adhesive. Electrical ground, low volume resistivity. Rapid cure 5min @ 125°C. Low temp. cure 20min @ 65°C.
2072
2072-MSDS
2080 Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006" needle. Low temp. cure.
2080
2080
2120 Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.
2120
2120-MSDS
2121 Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.
2121
2121-MSDS