ENCAPSULANTS

Part #
Description
DATASHEET
MSDS
6400 Encapsulating adhesive, capable of bonding to many surfaces. Bonds well to glass, ferrite, aluminum and steel. Tg = 99°C, low weight loss.
6400
6400-MSDS
6407 Filled system with good properties for humidity and thermal cycling, high dimensional stability. Thick paste.
6407
6407-MSDS
6470 High dimensional stability when bonding ferrite to ceramic. Good resistance to humidity.
6470
6470-MSDS
6570 A translucent, encapsulating epoxy adhesive
6570
6570-MSDS
6577 Medium viscosity encapsulant / sealant, room temperature cure, good impact and thermal shock properties.
6577
6577-MSDS
7780 Moisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing.
7780
7780-MSDS
7784 Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130°C
7784
7784-MSDS