756 N. Pastoria Avenue
Sunnyvale, CA 94085 USA
Phone:408.830.9200
|     
FLIP
CHIP UNDERFILL
| Part #
|
Description
|
DATASHEET
|
MSDS
|
| 6905
|
Combination
underfill and flux for flip chip solder reflow. Solder reflow
to 240°C. Flux and encapsulant. Epoxy gels in 30 seconds @
240°C. |
6905
|
6905
|
| 6980
|
Flip
chip underfill adhesive |
6980
|
6980-MSDS
|
| 7990
|
Chip
scale underfill encapsulant, 1 mil gap. Low mobile ions. Long
work life. |
7990
|
-
|
|
| |
| |
|
