HEAT SINK ATTACH

Part #
Description
DATASHEET
MSDS
6770 Dielectric epoxy adhesive formulated for attaching surface mounted devices to PC boards prior to wave solder.
6770
6770-MSDS
6771 Surface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200°C Tg = 154°C
6771
6771-MSDS
7080 Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.
7080
7080-MSDS
7081 Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.
7081
7081-MSDS
7784 Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130°C
7784
7784-MSDS
7794 Thermally conductive adhesive, designed for difficult to ond materials
7794
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