SEALANTS

Part #
Description
DATASHEET
MSDS
6485 Snap cure adhesive - cure 1 min @ 180°C. Microelectronic bonding, ceramic substrate and package sealing.
6485
6485-MSDS
6570 A translucent, encapsulating epoxy adhesive
6570
6570-MSDS
7247 Low CTE, excellent for bonding and sealing electronic instruments. Low temp. cure for bonding critical electronic instruments. CTE = 18 x 10-6 in/in/°C
7247
7247-MSDS
7247unf Unfilled version of 7247. Low temp. cure for bonding critical electronic instruments. No weight loss @ 105°C.
7247UNF
7247UNF-MSDS