TAPE HEADS

Part #
Description
DATASHEET
MSDS
2120 Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.
2120
2120-MSDS
6515 Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series
6515
6515-MSDS
6900 Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60°C / 80% R.H.
6900
6900-MSDS