| 2080 | CATHETER ASSEMBLY | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | DIAGNOSTIC EQUIPMENT | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | ELECTRICAL GROUNDING | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | MEDICAL ELECTRONICS | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | NEEDLE ASSEMBLY | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | STERILE DISPOSABLES | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | TRANSDUCER ASSEMBLY | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | ULTRASOUND | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2120 | ELECTRICAL GROUNDING | Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options. | 2120 Datasheet | 2120 SDS |
| 2121 | CATHETER ASSEMBLY | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | CLASS VI - MEDICAL GRADE | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | DIAGNOSTIC EQUIPMENT | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | ELECTRICAL GROUNDING | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | MEDICAL ELECTRONICS | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | NEEDLE ASSEMBLY | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | STERILE DISPOSABLES | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | ULTRASOUND | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2156 | CATHETER ASSEMBLY | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2156 | DIAGNOSTIC EQUIPMENT | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2156 | MEDICAL ELECTRONICS | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2156 | NEEDLE ASSEMBLY | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2156 | STERILE DISPOSABLES | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2156 | TRANSDUCER ASSEMBLY | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2156 | ULTRASOUND | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2158 | CATHETER ASSEMBLY | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2158 | DIAGNOSTIC EQUIPMENT | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2158 | LCD | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2158 | MEDICAL ELECTRONICS | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2158 | NEEDLE ASSEMBLY | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2158 | STERILE DISPOSABLES | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2158 | TRANSDUCER ASSEMBLY | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2158 | ULTRASOUND | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2160 | SMART CARD | Flexible, silver filled, Smart Card Adhesive. | 2160 Datasheet | 2160 SDS |
| 2258 | SMART CARD | Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade. | 2258 Datasheet | 2258 SDS |
| 2900 | CHIP CAPACITOR - SENSORS | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900 | CHIP SCALE - BGA - SOLDER REFLOW | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900 | DIE ATTACH | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900 | SEMICONDUCTOR GRADE | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900LV | CHIP CAPACITOR - SENSORS | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2900LV | CHIP SCALE - BGA - SOLDER REFLOW | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2900LV | DIE ATTACH | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2900LV | SEMICONDUCTOR GRADE | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2920 | DIE ATTACH | New Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life. | 2920 Datasheet | 2920 SDS |
| 2920 | SEMICONDUCTOR GRADE | New Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life. | 2920 Datasheet | 2920 SDS |
| 2948 | CHIP CAPACITOR - SENSORS | Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed. | 2948 Datasheet | 2948 SDS |
| 2948 | CHIP SCALE - BGA - SOLDER REFLOW | Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed. | 2948 Datasheet | 2948 SDS |
| 2948 | DIE ATTACH | Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed. | 2948 Datasheet | 2948 SDS |
| 2948 | SEMICONDUCTOR GRADE | Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed. | 2948 Datasheet | 2948 SDS |
| 2949 | DIE ATTACH | Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces. | 2949 Datasheet | 2949 SDS |
| 2990 | CHIP SCALE - BGA - SOLDER REFLOW | Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant. | 2990 Datasheet | 2990 SDS |
| 2990 | DIE ATTACH | Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant. | 2990 Datasheet | 2990 SDS |
| 2990 | SEMICONDUCTOR GRADE | Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant. | 2990 Datasheet | 2990 SDS |
| 6050 | LCD | Four hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp. | 6050 Datasheet | 6050 SDS |
| 6460 | LCD | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6460 | MEDICAL ELECTRONICS | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6460 | NEEDLE ASSEMBLY | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6460 | ULTRASOUND | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6485 | SEALANTS | Snap cure adhesive - cure 1 min @ 180° C. Microelectronic bonding, ceramic substrate and package sealing. | 6485 Datasheet | 6485 SDS |
| 6501 | CATHETER ASSEMBLY | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6501 | DIAGNOSTIC EQUIPMENT | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6501 | MEDICAL ELECTRONICS | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6501 | NEEDLE ASSEMBLY | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6501 | STERILE DISPOSABLES | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6501 | ULTRASOUND | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6511 | CATHETER ASSEMBLY | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6511 | DIAGNOSTIC EQUIPMENT | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6511 | MEDICAL ELECTRONICS | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6511 | NEEDLE ASSEMBLY | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6511 | STERILE DISPOSABLES | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6511 | TRANSDUCER ASSEMBLY | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6511 | ULTRASOUND | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6555 | OPTICS | Low outgassing epoxy adhesive, excellent for bonding semipourous material | 6555 Datasheet | 6555 SDS |
| 6560 | OPTICS | Low viscosity version of Bondline 6555 | 6560 Datasheet | 6560 SDS |
| 6570 | CHIP CAPACITOR - SENSORS | A translucent, encapsulating epoxy adhesive | 6570 Datasheet | 6570 SDS |
| 6570 | ENCAPSULANTS | A translucent, encapsulating epoxy adhesive | 6570 Datasheet | 6570 SDS |
| 6570 | SEALANTS | A translucent, encapsulating epoxy adhesive | 6570 Datasheet | 6570 SDS |
| 6571 | CHIP SCALE - BGA - SOLDER REFLOW | A black version of 6570 | 6571 Datasheet | 6571 SDS |
| 6577 | ENCAPSULANTS | Medium viscosity encapsulant / sealant, room temperature cure, good impact and thermal shock properties. | 6577 Datasheet | 6577 SDS |
| 6640 | CATHETER | General purpose, room temperature cure epoxy adhesive / Medical grade | 6640 Datasheet | 6640 SDS |
| 6640 | CLASS VI - MEDICAL GRADE | General purpose, room temperature cure epoxy adhesive / Medical grade | 6640 Datasheet | 6640 SDS |
| 6680 | WET COIL WINDING | For use in wet coil winding | 6680 Datasheet | 6680 SDS |
| 6771 | HEAT SINK ATTACH | Surface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200øC Tg = 154° C | 6771 Datasheet | 6771 SDS |
| 6771 | SMT | Surface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200øC Tg = 154° C | 6771 Datasheet | 6771 SDS |
| 6860 | CATHETER | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | CLASS VI - MEDICAL GRADE | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | DIAGNOSTIC EQUIPMENT | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | MEDICAL ELECTRONICS | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | NEEDLE ASSEMBLY | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | STERILE DISPOSABLES | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | ULTRASOUND | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6875 | CATHETER | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | CLASS VI - MEDICAL GRADE | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | COIL TACKING | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | DIAGNOSTIC EQUIPMENT | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | MEDICAL ELECTRONICS | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | NEEDLE ASSEMBLY | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | STERILE DISPOSABLES | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | ULTRASOUND | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6900 | CHIP SCALE - BGA - SOLDER REFLOW | Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H. | 6900 Datasheet | 6900 SDS |
| 6900 | SEMICONDUCTOR GRADE | Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H. | 6900 Datasheet | 6900 SDS |
| 6905 | CHIP SCALE - BGA - SOLDER REFLOW | Combination underfill and flux for flip chip solder reflow. Solder reflow to 240° C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C. | 6905 Datasheet | 6905 SDS |
| 6905 | FLIP CHIP UNDERFILL | Combination underfill and flux for flip chip solder reflow. Solder reflow to 240° C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C. | 6905 Datasheet | 6905 SDS |
| 6905 | SEMICONDUCTOR GRADE | Combination underfill and flux for flip chip solder reflow. Solder reflow to 240° C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C. | 6905 Datasheet | 6905 SDS |
| 6959 | CHIP SCALE - BGA - SOLDER REFLOW | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. | 6959 Datasheet | 6959 SDS |
| 6959 | DIE ATTACH | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. | 6959 Datasheet | 6959 SDS |
| 6959 | SEMICONDUCTOR GRADE | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. | 6959 Datasheet | 6959 SDS |
| 6968 | CHIP SCALE - BGA - SOLDER REFLOW | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed. | 6968 Datasheet | 6968 SDS |
| 6968 | SEMICONDUCTOR GRADE | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed. | 6968 Datasheet | 6968 SDS |
| 6980 | CHIP SCALE - BGA - SOLDER REFLOW | Flip chip underfill adhesive | 6980 Datasheet | 6980 SDS |
| 6980 | FLIP CHIP UNDERFILL | Flip chip underfill adhesive | 6980 Datasheet | 6980 SDS |
| 6980 | SEMICONDUCTOR GRADE | Flip chip underfill adhesive | 6980 Datasheet | 6980 SDS |
| 7080 | HEAT SINK ATTACH | Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder. | 7080 Datasheet | 7080 SDS |
| 7080 | SMT | Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder. | 7080 Datasheet | 7080 SDS |
| 7081 | HEAT SINK ATTACH | Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder. | 7081 Datasheet | 7081 SDS |
| 7081 | SMT | Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder. | 7081 Datasheet | 7081 SDS |
| 7247 | SEALANTS | Low CTE, excellent for bonding and sealing electronic instruments. Low temp. cure for bonding critical electronic instruments. CTE = 18 x 10-6 in/in/° C | 7247 Datasheet | 7247 SDS |
| 7247UNF | SEALANTS | Unfilled version of 7247. Low temp. cure for bonding critical electronic instruments. No weight loss @ 105° C. | 7247UNF Datasheet | 7247UNF SDS |
| 7258 | SEMICONDUCTOR GRADE | Thermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE. | 7258 Datasheet | 7258 SDS |
| 7780 | ENCAPSULANTS | Moisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing. | 7780 Datasheet | 7780 SDS |
| 7784 | ENCAPSULANTS | Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C | 7784 Datasheet | 7784 SDS |
| 7784 | HEAT SINK ATTACH | Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C | 7784 Datasheet | 7784 SDS |
