Adhesive by Application

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ProductApplicationDescriptionDatasheetSDS
2080CATHETER ASSEMBLYSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080DIAGNOSTIC EQUIPMENTSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080ELECTRICAL GROUNDINGSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080MEDICAL ELECTRONICSSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080NEEDLE ASSEMBLYSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080STERILE DISPOSABLESSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080TRANSDUCER ASSEMBLYSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080ULTRASOUNDSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2120ELECTRICAL GROUNDINGSilver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.2120 Datasheet2120 SDS
2121CATHETER ASSEMBLYSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121CLASS VI - MEDICAL GRADESilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121DIAGNOSTIC EQUIPMENTSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121ELECTRICAL GROUNDINGSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121MEDICAL ELECTRONICSSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121NEEDLE ASSEMBLYSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121STERILE DISPOSABLESSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121ULTRASOUNDSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156CATHETER ASSEMBLYSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156DIAGNOSTIC EQUIPMENTSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156MEDICAL ELECTRONICSSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156NEEDLE ASSEMBLYSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156STERILE DISPOSABLESSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156TRANSDUCER ASSEMBLYSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156ULTRASOUNDSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2158CATHETER ASSEMBLYA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2158DIAGNOSTIC EQUIPMENTA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2158LCDA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2158MEDICAL ELECTRONICSA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2158NEEDLE ASSEMBLYA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2158STERILE DISPOSABLESA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2158TRANSDUCER ASSEMBLYA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2158ULTRASOUNDA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2160SMART CARDFlexible, silver filled, Smart Card Adhesive.2160 Datasheet2160 SDS
2258SMART CARDFlexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.2258 Datasheet2258 SDS
2900CHIP CAPACITOR - SENSORSSilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900CHIP SCALE - BGA - SOLDER REFLOWSilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900DIE ATTACHSilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900SEMICONDUCTOR GRADESilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900LVCHIP CAPACITOR - SENSORSLow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2900LVCHIP SCALE - BGA - SOLDER REFLOWLow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2900LVDIE ATTACHLow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2900LVSEMICONDUCTOR GRADELow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2920DIE ATTACHNew Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life.2920 Datasheet2920 SDS
2920SEMICONDUCTOR GRADENew Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life.2920 Datasheet2920 SDS
2948CHIP CAPACITOR - SENSORSSilver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2948CHIP SCALE - BGA - SOLDER REFLOWSilver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2948DIE ATTACHSilver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2948SEMICONDUCTOR GRADESilver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2949DIE ATTACHSilver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.2949 Datasheet2949 SDS
2990CHIP SCALE - BGA - SOLDER REFLOWDie attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.2990 Datasheet2990 SDS
2990DIE ATTACHDie attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.2990 Datasheet2990 SDS
2990SEMICONDUCTOR GRADEDie attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.2990 Datasheet2990 SDS
6050LCDFour hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp.6050 Datasheet6050 SDS
6460LCDUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6460MEDICAL ELECTRONICSUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6460NEEDLE ASSEMBLYUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6460ULTRASOUNDUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6485SEALANTSSnap cure adhesive - cure 1 min @ 180° C. Microelectronic bonding, ceramic substrate and package sealing.6485 Datasheet6485 SDS
6501CATHETER ASSEMBLYLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6501DIAGNOSTIC EQUIPMENTLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6501MEDICAL ELECTRONICSLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6501NEEDLE ASSEMBLYLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6501STERILE DISPOSABLESLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6501ULTRASOUNDLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6511CATHETER ASSEMBLYLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6511DIAGNOSTIC EQUIPMENTLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6511MEDICAL ELECTRONICSLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6511NEEDLE ASSEMBLYLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6511STERILE DISPOSABLESLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6511TRANSDUCER ASSEMBLYLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6511ULTRASOUNDLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6555OPTICSLow outgassing epoxy adhesive, excellent for bonding semipourous material6555 Datasheet6555 SDS
6560OPTICSLow viscosity version of Bondline 65556560 Datasheet6560 SDS
6570CHIP CAPACITOR - SENSORSA translucent, encapsulating epoxy adhesive6570 Datasheet6570 SDS
6570ENCAPSULANTSA translucent, encapsulating epoxy adhesive6570 Datasheet6570 SDS
6570SEALANTSA translucent, encapsulating epoxy adhesive6570 Datasheet6570 SDS
6571CHIP SCALE - BGA - SOLDER REFLOWA black version of 65706571 Datasheet6571 SDS
6577ENCAPSULANTSMedium viscosity encapsulant / sealant, room temperature cure, good impact and thermal shock properties.6577 Datasheet6577 SDS
6640CATHETERGeneral purpose, room temperature cure epoxy adhesive / Medical grade6640 Datasheet6640 SDS
6640CLASS VI - MEDICAL GRADEGeneral purpose, room temperature cure epoxy adhesive / Medical grade6640 Datasheet6640 SDS
6680WET COIL WINDINGFor use in wet coil winding6680 Datasheet6680 SDS
6771HEAT SINK ATTACHSurface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200øC Tg = 154° C6771 Datasheet6771 SDS
6771SMTSurface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200øC Tg = 154° C6771 Datasheet6771 SDS
6860CATHETERLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860CLASS VI - MEDICAL GRADELowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860DIAGNOSTIC EQUIPMENTLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860MEDICAL ELECTRONICSLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860NEEDLE ASSEMBLYLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860STERILE DISPOSABLESLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860ULTRASOUNDLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6875CATHETERLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875CLASS VI - MEDICAL GRADELow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875COIL TACKINGLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875DIAGNOSTIC EQUIPMENTLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875MEDICAL ELECTRONICSLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875NEEDLE ASSEMBLYLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875STERILE DISPOSABLESLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875ULTRASOUNDLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6900CHIP SCALE - BGA - SOLDER REFLOWLow viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H.6900 Datasheet6900 SDS
6900SEMICONDUCTOR GRADELow viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H.6900 Datasheet6900 SDS
6905CHIP SCALE - BGA - SOLDER REFLOWCombination underfill and flux for flip chip solder reflow. Solder reflow to 240° C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C.6905 Datasheet6905 SDS
6905FLIP CHIP UNDERFILLCombination underfill and flux for flip chip solder reflow. Solder reflow to 240° C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C.6905 Datasheet6905 SDS
6905SEMICONDUCTOR GRADECombination underfill and flux for flip chip solder reflow. Solder reflow to 240° C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C.6905 Datasheet6905 SDS
6959CHIP SCALE - BGA - SOLDER REFLOWDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C.6959 Datasheet6959 SDS
6959DIE ATTACHDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C.6959 Datasheet6959 SDS
6959SEMICONDUCTOR GRADEDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C.6959 Datasheet6959 SDS
6968CHIP SCALE - BGA - SOLDER REFLOWDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.6968 Datasheet6968 SDS
6968SEMICONDUCTOR GRADEDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.6968 Datasheet6968 SDS
6980CHIP SCALE - BGA - SOLDER REFLOWFlip chip underfill adhesive6980 Datasheet6980 SDS
6980FLIP CHIP UNDERFILLFlip chip underfill adhesive6980 Datasheet6980 SDS
6980SEMICONDUCTOR GRADEFlip chip underfill adhesive6980 Datasheet6980 SDS
7080HEAT SINK ATTACHBondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7080SMTBondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7081HEAT SINK ATTACHBondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7081SMTBondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7247SEALANTSLow CTE, excellent for bonding and sealing electronic instruments. Low temp. cure for bonding critical electronic instruments. CTE = 18 x 10-6 in/in/° C7247 Datasheet7247 SDS
7247UNFSEALANTSUnfilled version of 7247. Low temp. cure for bonding critical electronic instruments. No weight loss @ 105° C.7247UNF Datasheet7247UNF SDS
7258SEMICONDUCTOR GRADEThermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE.7258 Datasheet7258 SDS
7780ENCAPSULANTSMoisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing.7780 Datasheet7780 SDS
7784ENCAPSULANTSThermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C7784 Datasheet7784 SDS
7784HEAT SINK ATTACHThermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C7784 Datasheet7784 SDS