Adhesive by Property

Search or Sort by Property
ProductPropertyDescriptionDatasheetSDS
2080ELECTRICALLY CONDUCTIVESilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080LOW TEMPERATURE CURESilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2080USP CLASS VI COMPLIANTSilver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2106ELECTRICALLY CONDUCTIVEFlexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.2106 Datasheet2106 SDS
2111ELECTRICALLY CONDUCTIVEFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2111FLEXIBLEFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2111LOW TEMPERATURE CUREFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2120ELECTRICALLY CONDUCTIVESilver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.2120 Datasheet2120 SDS
2120LOW TEMPERATURE CURESilver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.2120 Datasheet2120 SDS
2120SNAP CURE - RAPID CURESilver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.2120 Datasheet2120 SDS
2121ELECTRICALLY CONDUCTIVESilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121LOW TEMPERATURE CURESilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121SNAP CURE - RAPID CURESilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2121USP CLASS VI COMPLIANTSilver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156USP CLASS VI COMPLIANTA resilient tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion ,low volume resistivity and thermal conductivity.2156 Datasheet2156 SDS
2158USP CLASS VI COMPLIANTA tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2160ELECTRICALLY CONDUCTIVEFlexible, silver filled, Smart Card Adhesive.2160 Datasheet2160 SDS
2160FLEXIBLEFlexible, silver filled, Smart Card Adhesive.2160 Datasheet2160 SDS
2160LOW TEMPERATURE CUREFlexible, silver filled, Smart Card Adhesive.2160 Datasheet2160 SDS
2258ELECTRICALLY CONDUCTIVEFlexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.2258 Datasheet2258 SDS
2258FLEXIBLEFlexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.2258 Datasheet2258 SDS
2258LOW TEMPERATURE CUREFlexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.2258 Datasheet2258 SDS
2485ELECTRICALLY CONDUCTIVESilver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.2485 Datasheet2485 SDS
2485HIGH TEMPERATURE RESISTANTSilver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.2485 Datasheet2485 SDS
2485SNAP CURE - RAPID CURESilver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.2485 Datasheet2485 SDS
2490ELECTRICALLY CONDUCTIVEElectrically conductive epoxy adhesive for chip bonding. Microelectronic applications, automatic dispensing, screen printing or hand dispense, high Tg 143° C.2490 Datasheet2490 SDS
2900ELECTRICALLY CONDUCTIVESilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900NON-CORROSIVE - NON-TAILING - NON-BLEEDINGSilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900LVELECTRICALLY CONDUCTIVELow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2900LVNON-CORROSIVE - NON-TAILING - NON-BLEEDINGLow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2920ELECTRICALLY CONDUCTIVENew Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life.2920 Datasheet2920 SDS
2948ELECTRICALLY CONDUCTIVESilver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2948NON-CORROSIVE - NON-TAILING - NON-BLEEDINGSilver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2949ELECTRICALLY CONDUCTIVESilver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.2949 Datasheet2949 SDS
2990ELECTRICALLY CONDUCTIVEDie attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.2990 Datasheet2990 SDS
2990MOISTURE RESISTANTDie attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.2990 Datasheet2990 SDS
2990SNAP CURE - RAPID CUREDie attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.2990 Datasheet2990 SDS
6050LOW TEMPERATURE CUREFour hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp.6050 Datasheet6050 SDS
6050SNAP CURE - RAPID CUREFour hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp.6050 Datasheet6050 SDS
6150FLEXIBLEHigh strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.6150 Datasheet6150 SDS
6150MOISTURE RESISTANTHigh strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.6150 Datasheet6150 SDS
6150STRUCTURAL BONDINGHigh strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.6150 Datasheet6150 SDS
6150WITHSTAND HIGH HUMIDITY AND THERMAL CYCLINGHigh strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.6150 Datasheet6150 SDS
6165STRUCTURAL BONDINGStructural adhesive, high peel strength, good for bonding dissimilar substrate6165 Datasheet6165 SDS
6175LOW TEMPERATURE CURENon-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.6175 Datasheet6175 SDS
6175MOISTURE RESISTANTNon-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.6175 Datasheet6175 SDS
6175STRUCTURAL BONDINGNon-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.6175 Datasheet6175 SDS
6175WITHSTAND HIGH HUMIDITY AND THERMAL CYCLINGNon-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.6175 Datasheet6175 SDS
6195WITHSTAND HIGH HUMIDITY AND THERMAL CYCLINGFilled epoxy system with good properties for humidity and thermal cycling6195 Datasheet6195 SDS
6200MOISTURE RESISTANTOffers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability.6200 Datasheet6200 SDS
6200WITHSTAND HIGH HUMIDITY AND THERMAL CYCLINGOffers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability.6200 Datasheet6200 SDS
6250STRUCTURAL BONDINGSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6460STRUCTURAL BONDINGUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6460OPTICALLY CLEARUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6485SNAP CURE - RAPID CURESnap cure adhesive - cure 1 min @ 180° C. Microelectronic bonding, ceramic substrate and package sealing.6485 Datasheet6485 SDS
6500SNAP CURE - RAPID CURERapid curing adhesive with a strong structural bond6500 Datasheet6500 SDS
6500STRUCTURAL BONDINGRapid curing adhesive with a strong structural bond6500 Datasheet6500 SDS
6501LOW OUTGASSINGLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6501STRUCTURAL BONDINGLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6511LOW OUTGASSINGLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6511SNAP CURE - RAPID CURELow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6511USP CLASS VI COMPLIANTLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6515LOW OUTGASSINGLow outgassing epoxy adhesive, controlled flow version of Bondline 6500 series6515 Datasheet6515 SDS
6515SNAP CURE - RAPID CURELow outgassing epoxy adhesive, controlled flow version of Bondline 6500 series6515 Datasheet6515 SDS
6555LOW OUTGASSINGLow outgassing epoxy adhesive, excellent for bonding semipourous material6555 Datasheet6555 SDS
6555OPTICALLY CLEARLow outgassing epoxy adhesive, excellent for bonding semipourous material6555 Datasheet6555 SDS
6577MOISTURE RESISTANTMedium viscosity encapsulant / sealant, room temperature cure, good impact and thermal shock properties.6577 Datasheet6577 SDS
6640STRUCTURAL BONDINGGeneral purpose, room temperature cure epoxy adhesive / Medical grade6640 Datasheet6640 SDS
6640USP CLASS VI COMPLIANTGeneral purpose, room temperature cure epoxy adhesive / Medical grade6640 Datasheet6640 SDS
6682HIGH TEMPERATURE RESISTANTRapid cure at high temperatures, superior high temperature properties6682 Datasheet6682 SDS
6682SNAP CURE - RAPID CURERapid cure at high temperatures, superior high temperature properties6682 Datasheet6682 SDS
6771HIGH TEMPERATURE RESISTANTSurface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200° C Tg = 154° C6771 Datasheet6771 SDS
6860FLEXIBLELowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860POLYURETHANELowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860USP CLASS VI COMPLIANTLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6875FLEXIBLELow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875POLYURETHANELow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875USP CLASS VI COMPLIANTLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6900WITHSTAND HIGH HUMIDITY AND THERMAL CYCLINGLow viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H.6900 Datasheet6900 SDS
6905HIGH TEMPERATURE RESISTANTCombination underfill and flux for flip chip solder reflow. Solder reflow to 240° C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C.6905 Datasheet6905 SDS
6959NON-CORROSIVE - NON-TAILING - NON-BLEEDINGDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C.6959 Datasheet6959 SDS
6959SNAP CURE - RAPID CUREDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C.6959 Datasheet6959 SDS
6968NON-CORROSIVE - NON-TAILING - NON-BLEEDINGDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.6968 Datasheet6968 SDS
6968SNAP CURE - RAPID CUREDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.6968 Datasheet6968 SDS
7080THERMALLY CONDUCTIVEBondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7081THERMALLY CONDUCTIVEBondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7086STRUCTURAL BONDINGStructural adhesive that provides an excellent bond to metal surfaces.7086 Datasheet7086 SDS
7153SNAP CURE - RAPID CUREUsed for general bonding. Fast, low temperature cure schedule.7153 Datasheet7153 SDS
7247LOW TEMPERATURE CURELow CTE, excellent for bonding and sealing electronic instruments. Low temp. cure for bonding critical electronic instruments. CTE = 18 x 10-6 in/in/° C7247 Datasheet7247 SDS
7247UNFLOW TEMPERATURE CUREUnfilled version of 7247. Low temp. cure for bonding critical electronic instruments. No weight loss @ 105° C.7247UNF Datasheet7247UNF SDS
7258FLEXIBLEThermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE.7258 Datasheet7258 SDS
7258THERMALLY CONDUCTIVEThermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE.7258 Datasheet7258 SDS
7352HIGH TEMPERATURE RESISTANTStructural Adhesive, for difficult-to-bond materials. Long work life.7352 Datasheet7352 SDS
7352STRUCTURAL BONDINGStructural Adhesive, for difficult-to-bond materials. Long work life.7352 Datasheet7352 SDS
7780MOISTURE RESISTANTMoisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing.7780 Datasheet7780 SDS
7780WITHSTAND HIGH HUMIDITY AND THERMAL CYCLINGMoisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing.7780 Datasheet7780 SDS
7784HIGH TEMPERATURE RESISTANTThermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C7784 Datasheet7784 SDS
7784MOISTURE RESISTANTThermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C7784 Datasheet7784 SDS
7784THERMALLY CONDUCTIVEThermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C7784 Datasheet7784 SDS