| 2080 | ELECTRICALLY CONDUCTIVE | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | LOW TEMPERATURE CURE | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2080 | USP CLASS VI COMPLIANT | Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure. | 2080 Datasheet | 2080 SDS |
| 2106 | ELECTRICALLY CONDUCTIVE | Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C. | 2106 Datasheet | 2106 SDS |
| 2111 | ELECTRICALLY CONDUCTIVE | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2111 | FLEXIBLE | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2111 | LOW TEMPERATURE CURE | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2120 | ELECTRICALLY CONDUCTIVE | Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options. | 2120 Datasheet | 2120 SDS |
| 2120 | LOW TEMPERATURE CURE | Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options. | 2120 Datasheet | 2120 SDS |
| 2120 | SNAP CURE - RAPID CURE | Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options. | 2120 Datasheet | 2120 SDS |
| 2121 | ELECTRICALLY CONDUCTIVE | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | LOW TEMPERATURE CURE | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | SNAP CURE - RAPID CURE | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2121 | USP CLASS VI COMPLIANT | Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability. | 2121 Datasheet | 2121 SDS |
| 2156 | USP CLASS VI COMPLIANT | A resilient tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion ,low volume resistivity and thermal conductivity. | 2156 Datasheet | 2156 SDS |
| 2158 | USP CLASS VI COMPLIANT | A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure. | 2158 Datasheet | 2158 SDS |
| 2160 | ELECTRICALLY CONDUCTIVE | Flexible, silver filled, Smart Card Adhesive. | 2160 Datasheet | 2160 SDS |
| 2160 | FLEXIBLE | Flexible, silver filled, Smart Card Adhesive. | 2160 Datasheet | 2160 SDS |
| 2160 | LOW TEMPERATURE CURE | Flexible, silver filled, Smart Card Adhesive. | 2160 Datasheet | 2160 SDS |
| 2258 | ELECTRICALLY CONDUCTIVE | Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade. | 2258 Datasheet | 2258 SDS |
| 2258 | FLEXIBLE | Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade. | 2258 Datasheet | 2258 SDS |
| 2258 | LOW TEMPERATURE CURE | Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade. | 2258 Datasheet | 2258 SDS |
| 2485 | ELECTRICALLY CONDUCTIVE | Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity. | 2485 Datasheet | 2485 SDS |
| 2485 | HIGH TEMPERATURE RESISTANT | Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity. | 2485 Datasheet | 2485 SDS |
| 2485 | SNAP CURE - RAPID CURE | Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity. | 2485 Datasheet | 2485 SDS |
| 2490 | ELECTRICALLY CONDUCTIVE | Electrically conductive epoxy adhesive for chip bonding. Microelectronic applications, automatic dispensing, screen printing or hand dispense, high Tg 143° C. | 2490 Datasheet | 2490 SDS |
| 2900 | ELECTRICALLY CONDUCTIVE | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900 | NON-CORROSIVE - NON-TAILING - NON-BLEEDING | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900LV | ELECTRICALLY CONDUCTIVE | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2900LV | NON-CORROSIVE - NON-TAILING - NON-BLEEDING | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2920 | ELECTRICALLY CONDUCTIVE | New Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life. | 2920 Datasheet | 2920 SDS |
| 2948 | ELECTRICALLY CONDUCTIVE | Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed. | 2948 Datasheet | 2948 SDS |
| 2948 | NON-CORROSIVE - NON-TAILING - NON-BLEEDING | Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed. | 2948 Datasheet | 2948 SDS |
| 2949 | ELECTRICALLY CONDUCTIVE | Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces. | 2949 Datasheet | 2949 SDS |
| 2990 | ELECTRICALLY CONDUCTIVE | Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant. | 2990 Datasheet | 2990 SDS |
| 2990 | MOISTURE RESISTANT | Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant. | 2990 Datasheet | 2990 SDS |
| 2990 | SNAP CURE - RAPID CURE | Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant. | 2990 Datasheet | 2990 SDS |
| 6050 | LOW TEMPERATURE CURE | Four hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp. | 6050 Datasheet | 6050 SDS |
| 6050 | SNAP CURE - RAPID CURE | Four hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp. | 6050 Datasheet | 6050 SDS |
| 6150 | FLEXIBLE | High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability. | 6150 Datasheet | 6150 SDS |
| 6150 | MOISTURE RESISTANT | High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability. | 6150 Datasheet | 6150 SDS |
| 6150 | STRUCTURAL BONDING | High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability. | 6150 Datasheet | 6150 SDS |
| 6150 | WITHSTAND HIGH HUMIDITY AND THERMAL CYCLING | High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability. | 6150 Datasheet | 6150 SDS |
| 6165 | STRUCTURAL BONDING | Structural adhesive, high peel strength, good for bonding dissimilar substrate | 6165 Datasheet | 6165 SDS |
| 6175 | LOW TEMPERATURE CURE | Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options. | 6175 Datasheet | 6175 SDS |
| 6175 | MOISTURE RESISTANT | Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options. | 6175 Datasheet | 6175 SDS |
| 6175 | STRUCTURAL BONDING | Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options. | 6175 Datasheet | 6175 SDS |
| 6175 | WITHSTAND HIGH HUMIDITY AND THERMAL CYCLING | Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options. | 6175 Datasheet | 6175 SDS |
| 6195 | WITHSTAND HIGH HUMIDITY AND THERMAL CYCLING | Filled epoxy system with good properties for humidity and thermal cycling | 6195 Datasheet | 6195 SDS |
| 6200 | MOISTURE RESISTANT | Offers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability. | 6200 Datasheet | 6200 SDS |
| 6200 | WITHSTAND HIGH HUMIDITY AND THERMAL CYCLING | Offers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability. | 6200 Datasheet | 6200 SDS |
| 6250 | STRUCTURAL BONDING | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6460 | STRUCTURAL BONDING | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6460 | OPTICALLY CLEAR | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6485 | SNAP CURE - RAPID CURE | Snap cure adhesive - cure 1 min @ 180° C. Microelectronic bonding, ceramic substrate and package sealing. | 6485 Datasheet | 6485 SDS |
| 6500 | SNAP CURE - RAPID CURE | Rapid curing adhesive with a strong structural bond | 6500 Datasheet | 6500 SDS |
| 6500 | STRUCTURAL BONDING | Rapid curing adhesive with a strong structural bond | 6500 Datasheet | 6500 SDS |
| 6501 | LOW OUTGASSING | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6501 | STRUCTURAL BONDING | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6511 | LOW OUTGASSING | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6511 | SNAP CURE - RAPID CURE | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6511 | USP CLASS VI COMPLIANT | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6515 | LOW OUTGASSING | Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series | 6515 Datasheet | 6515 SDS |
| 6515 | SNAP CURE - RAPID CURE | Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series | 6515 Datasheet | 6515 SDS |
| 6555 | LOW OUTGASSING | Low outgassing epoxy adhesive, excellent for bonding semipourous material | 6555 Datasheet | 6555 SDS |
| 6555 | OPTICALLY CLEAR | Low outgassing epoxy adhesive, excellent for bonding semipourous material | 6555 Datasheet | 6555 SDS |
| 6577 | MOISTURE RESISTANT | Medium viscosity encapsulant / sealant, room temperature cure, good impact and thermal shock properties. | 6577 Datasheet | 6577 SDS |
| 6640 | STRUCTURAL BONDING | General purpose, room temperature cure epoxy adhesive / Medical grade | 6640 Datasheet | 6640 SDS |
| 6640 | USP CLASS VI COMPLIANT | General purpose, room temperature cure epoxy adhesive / Medical grade | 6640 Datasheet | 6640 SDS |
| 6682 | HIGH TEMPERATURE RESISTANT | Rapid cure at high temperatures, superior high temperature properties | 6682 Datasheet | 6682 SDS |
| 6682 | SNAP CURE - RAPID CURE | Rapid cure at high temperatures, superior high temperature properties | 6682 Datasheet | 6682 SDS |
| 6771 | HIGH TEMPERATURE RESISTANT | Surface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200° C Tg = 154° C | 6771 Datasheet | 6771 SDS |
| 6860 | FLEXIBLE | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | POLYURETHANE | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | USP CLASS VI COMPLIANT | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6875 | FLEXIBLE | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | POLYURETHANE | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | USP CLASS VI COMPLIANT | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6900 | WITHSTAND HIGH HUMIDITY AND THERMAL CYCLING | Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H. | 6900 Datasheet | 6900 SDS |
| 6905 | HIGH TEMPERATURE RESISTANT | Combination underfill and flux for flip chip solder reflow. Solder reflow to 240° C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C. | 6905 Datasheet | 6905 SDS |
| 6959 | NON-CORROSIVE - NON-TAILING - NON-BLEEDING | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. | 6959 Datasheet | 6959 SDS |
| 6959 | SNAP CURE - RAPID CURE | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. | 6959 Datasheet | 6959 SDS |
| 6968 | NON-CORROSIVE - NON-TAILING - NON-BLEEDING | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed. | 6968 Datasheet | 6968 SDS |
| 6968 | SNAP CURE - RAPID CURE | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed. | 6968 Datasheet | 6968 SDS |
| 7080 | THERMALLY CONDUCTIVE | Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder. | 7080 Datasheet | 7080 SDS |
| 7081 | THERMALLY CONDUCTIVE | Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder. | 7081 Datasheet | 7081 SDS |
| 7086 | STRUCTURAL BONDING | Structural adhesive that provides an excellent bond to metal surfaces. | 7086 Datasheet | 7086 SDS |
| 7153 | SNAP CURE - RAPID CURE | Used for general bonding. Fast, low temperature cure schedule. | 7153 Datasheet | 7153 SDS |
| 7247 | LOW TEMPERATURE CURE | Low CTE, excellent for bonding and sealing electronic instruments. Low temp. cure for bonding critical electronic instruments. CTE = 18 x 10-6 in/in/° C | 7247 Datasheet | 7247 SDS |
| 7247UNF | LOW TEMPERATURE CURE | Unfilled version of 7247. Low temp. cure for bonding critical electronic instruments. No weight loss @ 105° C. | 7247UNF Datasheet | 7247UNF SDS |
| 7258 | FLEXIBLE | Thermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE. | 7258 Datasheet | 7258 SDS |
| 7258 | THERMALLY CONDUCTIVE | Thermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE. | 7258 Datasheet | 7258 SDS |
| 7352 | HIGH TEMPERATURE RESISTANT | Structural Adhesive, for difficult-to-bond materials. Long work life. | 7352 Datasheet | 7352 SDS |
| 7352 | STRUCTURAL BONDING | Structural Adhesive, for difficult-to-bond materials. Long work life. | 7352 Datasheet | 7352 SDS |
| 7780 | MOISTURE RESISTANT | Moisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing. | 7780 Datasheet | 7780 SDS |
| 7780 | WITHSTAND HIGH HUMIDITY AND THERMAL CYCLING | Moisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing. | 7780 Datasheet | 7780 SDS |
| 7784 | HIGH TEMPERATURE RESISTANT | Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C | 7784 Datasheet | 7784 SDS |
| 7784 | MOISTURE RESISTANT | Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C | 7784 Datasheet | 7784 SDS |
| 7784 | THERMALLY CONDUCTIVE | Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C | 7784 Datasheet | 7784 SDS |
