Adhesive by Surface

Search or Sort by Surface
ProductSurfaceDescriptionDatasheetSDS
2106GOLDFlexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.2106 Datasheet2106 SDS
2106LEADFlexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.2106 Datasheet2106 SDS
2106MISMATCHED CTEFlexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.2106 Datasheet2106 SDS
2106SILVERFlexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.2106 Datasheet2106 SDS
2106STAINLESS STEELFlexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.2106 Datasheet2106 SDS
2106DIFFICULT-TO-BONDFlexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.2106 Datasheet2106 SDS
2111GOLDFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2111LEADFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2111MISMATCHED CTEFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2111SILVERFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2111STAINLESS STEELFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2111DIFFICULT-TO-BONDFlexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2160MISMATCHED CTEFlexible, silver filled, Smart Card Adhesive.2160 Datasheet2160 SDS
2258MISMATCHED CTEFlexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.2258 Datasheet2258 SDS
2900COPPERSilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900GOLDSilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900SILVERSilver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900LVCOPPERLow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2900LVGOLDLow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2900LVSILVERLow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2948GOLDSilver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2948SILVERSilver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2949COPPERSilver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.2949 Datasheet2949 SDS
2949SILVERSilver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.2949 Datasheet2949 SDS
2949GOLDSilver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.2949 Datasheet2949 SDS
6250ALUMINUMSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250COPPERSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250CERAMICSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250FERRITESemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250GOLDSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250LEADSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250MISMATCHED CTESemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250PLASTICSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250RUBBERSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250SILVERSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250STAINLESS STEELSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6250STEELSemi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6275MISMATCHED CTEA resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.6275 Datasheet6275 SDS
6275PLASTICA resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.6275 Datasheet6275 SDS
6275STAINLESS STEELA resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.6275 Datasheet6275 SDS
6276MISMATCHED CTEA resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.6276 Datasheet6276 SDS
6460ALUMINUMUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6460FERRITEUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6460GLASSUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6460STEELUltra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6500ALUMINUMRapid curing adhesive with a strong structural bond6500 Datasheet6500 SDS
6500FERRITERapid curing adhesive with a strong structural bond6500 Datasheet6500 SDS
6500GLASSRapid curing adhesive with a strong structural bond6500 Datasheet6500 SDS
6500STEELRapid curing adhesive with a strong structural bond6500 Datasheet6500 SDS
6501GLASSLow outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6511GLASSLow outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6515GLASSLow outgassing epoxy adhesive, controlled flow version of Bondline 6500 series6515 Datasheet6515 SDS
6755DIFFICULT-TO-BONDLow viscosity epoxy, offers high dimensional stability6755 Datasheet6755 SDS
6860NYLONLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860POLYMIDELowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860RUBBERLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860STAINLESS STEELLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860STEELLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6860TUBING - PVCLowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6875NYLONLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875POLYMIDELow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875RUBBERLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875STAINLESS STEELLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875STEELLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6875TUBING - PVCLow outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6900CERAMICLow viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H.6900 Datasheet6900 SDS
6900FERRITELow viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H.6900 Datasheet6900 SDS
6900GLASSLow viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H.6900 Datasheet6900 SDS
6959COPPERDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175øC.6959 Datasheet6959 SDS
6959GOLDDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C.6959 Datasheet6959 SDS
6968COPPERDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.6968 Datasheet6968 SDS
6968GOLDDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.6968 Datasheet6968 SDS
6968SILVERDielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.6968 Datasheet6968 SDS
7080BRASSBondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7080COPPERBondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7080GOLDBondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7080SILVERBondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7080SOLDERBondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7081BRASSBondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7081COPPERBondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7081GOLDBondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7081SILVERBondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7081SOLDERBondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7086BRASSStructural adhesive that provides an excellent bond to metal surfaces.7086 Datasheet7086 SDS
7086COPPERStructural adhesive that provides an excellent bond to metal surfaces.7086 Datasheet7086 SDS
7086GOLDStructural adhesive that provides an excellent bond to metal surfaces.7086 Datasheet7086 SDS
7086SILVERStructural adhesive that provides an excellent bond to metal surfaces.7086 Datasheet7086 SDS
7086SOLDERStructural adhesive that provides an excellent bond to metal surfaces.7086 Datasheet7086 SDS
7152DIFFICULT-TO-BONDStructural Adhesive, for difficult-to-bond materials. Long work life.7152 Datasheet7152 SDS
7153ALUMINUMUsed for general bonding. Fast, low temperature cure schedule.7153 Datasheet7153 SDS
7153FERRITEUsed for general bonding. Fast, low temperature cure schedule.7153 Datasheet7153 SDS
7153GLASSUsed for general bonding. Fast, low temperature cure schedule.7153 Datasheet7153 SDS
7153STEELUsed for general bonding. Fast, low temperature cure schedule.7153 Datasheet7153 SDS
7258MISMATCHED CTEThermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE.7258 Datasheet7258 SDS
7784COPPERThermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C7784 Datasheet7784 SDS
7784DIFFICULT-TO-BONDThermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C7784 Datasheet7784 SDS