| 2106 | GOLD | Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C. | 2106 Datasheet | 2106 SDS |
| 2106 | LEAD | Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C. | 2106 Datasheet | 2106 SDS |
| 2106 | MISMATCHED CTE | Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C. | 2106 Datasheet | 2106 SDS |
| 2106 | SILVER | Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C. | 2106 Datasheet | 2106 SDS |
| 2106 | STAINLESS STEEL | Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C. | 2106 Datasheet | 2106 SDS |
| 2106 | DIFFICULT-TO-BOND | Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C. | 2106 Datasheet | 2106 SDS |
| 2111 | GOLD | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2111 | LEAD | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2111 | MISMATCHED CTE | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2111 | SILVER | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2111 | STAINLESS STEEL | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2111 | DIFFICULT-TO-BOND | Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure. | 2111 Datasheet | 2111 SDS |
| 2160 | MISMATCHED CTE | Flexible, silver filled, Smart Card Adhesive. | 2160 Datasheet | 2160 SDS |
| 2258 | MISMATCHED CTE | Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade. | 2258 Datasheet | 2258 SDS |
| 2900 | COPPER | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900 | GOLD | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900 | SILVER | Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900 Datasheet | 2900 SDS |
| 2900LV | COPPER | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2900LV | GOLD | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2900LV | SILVER | Low viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold. | 2900LV Datasheet | 2900LV SDS |
| 2948 | GOLD | Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed. | 2948 Datasheet | 2948 SDS |
| 2948 | SILVER | Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed. | 2948 Datasheet | 2948 SDS |
| 2949 | COPPER | Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces. | 2949 Datasheet | 2949 SDS |
| 2949 | SILVER | Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces. | 2949 Datasheet | 2949 SDS |
| 2949 | GOLD | Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces. | 2949 Datasheet | 2949 SDS |
| 6250 | ALUMINUM | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | COPPER | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | CERAMIC | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | FERRITE | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | GOLD | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | LEAD | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | MISMATCHED CTE | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | PLASTIC | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | RUBBER | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | SILVER | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | STAINLESS STEEL | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6250 | STEEL | Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE. | 6250 Datasheet | 6250 SDS |
| 6275 | MISMATCHED CTE | A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion. | 6275 Datasheet | 6275 SDS |
| 6275 | PLASTIC | A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion. | 6275 Datasheet | 6275 SDS |
| 6275 | STAINLESS STEEL | A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion. | 6275 Datasheet | 6275 SDS |
| 6276 | MISMATCHED CTE | A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion. | 6276 Datasheet | 6276 SDS |
| 6460 | ALUMINUM | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6460 | FERRITE | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6460 | GLASS | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6460 | STEEL | Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties. | 6460 Datasheet | 6460 SDS |
| 6500 | ALUMINUM | Rapid curing adhesive with a strong structural bond | 6500 Datasheet | 6500 SDS |
| 6500 | FERRITE | Rapid curing adhesive with a strong structural bond | 6500 Datasheet | 6500 SDS |
| 6500 | GLASS | Rapid curing adhesive with a strong structural bond | 6500 Datasheet | 6500 SDS |
| 6500 | STEEL | Rapid curing adhesive with a strong structural bond | 6500 Datasheet | 6500 SDS |
| 6501 | GLASS | Low outgassing, fast cure, epoxy adhesive | 6501 Datasheet | 6501 SDS |
| 6511 | GLASS | Low outgassing, fast cure, filled epoxy adhesive | 6511 Datasheet | 6511 SDS |
| 6515 | GLASS | Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series | 6515 Datasheet | 6515 SDS |
| 6755 | DIFFICULT-TO-BOND | Low viscosity epoxy, offers high dimensional stability | 6755 Datasheet | 6755 SDS |
| 6860 | NYLON | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | POLYMIDE | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | RUBBER | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | STAINLESS STEEL | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | STEEL | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6860 | TUBING - PVC | Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility. | 6860 Datasheet | 6860 SDS |
| 6875 | NYLON | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | POLYMIDE | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | RUBBER | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | STAINLESS STEEL | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | STEEL | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6875 | TUBING - PVC | Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive. | 6875 Datasheet | 6875 SDS |
| 6900 | CERAMIC | Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H. | 6900 Datasheet | 6900 SDS |
| 6900 | FERRITE | Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H. | 6900 Datasheet | 6900 SDS |
| 6900 | GLASS | Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H. | 6900 Datasheet | 6900 SDS |
| 6959 | COPPER | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175øC. | 6959 Datasheet | 6959 SDS |
| 6959 | GOLD | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. | 6959 Datasheet | 6959 SDS |
| 6968 | COPPER | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed. | 6968 Datasheet | 6968 SDS |
| 6968 | GOLD | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed. | 6968 Datasheet | 6968 SDS |
| 6968 | SILVER | Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed. | 6968 Datasheet | 6968 SDS |
| 7080 | BRASS | Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder. | 7080 Datasheet | 7080 SDS |
| 7080 | COPPER | Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder. | 7080 Datasheet | 7080 SDS |
| 7080 | GOLD | Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder. | 7080 Datasheet | 7080 SDS |
| 7080 | SILVER | Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder. | 7080 Datasheet | 7080 SDS |
| 7080 | SOLDER | Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder. | 7080 Datasheet | 7080 SDS |
| 7081 | BRASS | Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder. | 7081 Datasheet | 7081 SDS |
| 7081 | COPPER | Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder. | 7081 Datasheet | 7081 SDS |
| 7081 | GOLD | Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder. | 7081 Datasheet | 7081 SDS |
| 7081 | SILVER | Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder. | 7081 Datasheet | 7081 SDS |
| 7081 | SOLDER | Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder. | 7081 Datasheet | 7081 SDS |
| 7086 | BRASS | Structural adhesive that provides an excellent bond to metal surfaces. | 7086 Datasheet | 7086 SDS |
| 7086 | COPPER | Structural adhesive that provides an excellent bond to metal surfaces. | 7086 Datasheet | 7086 SDS |
| 7086 | GOLD | Structural adhesive that provides an excellent bond to metal surfaces. | 7086 Datasheet | 7086 SDS |
| 7086 | SILVER | Structural adhesive that provides an excellent bond to metal surfaces. | 7086 Datasheet | 7086 SDS |
| 7086 | SOLDER | Structural adhesive that provides an excellent bond to metal surfaces. | 7086 Datasheet | 7086 SDS |
| 7152 | DIFFICULT-TO-BOND | Structural Adhesive, for difficult-to-bond materials. Long work life. | 7152 Datasheet | 7152 SDS |
| 7153 | ALUMINUM | Used for general bonding. Fast, low temperature cure schedule. | 7153 Datasheet | 7153 SDS |
| 7153 | FERRITE | Used for general bonding. Fast, low temperature cure schedule. | 7153 Datasheet | 7153 SDS |
| 7153 | GLASS | Used for general bonding. Fast, low temperature cure schedule. | 7153 Datasheet | 7153 SDS |
| 7153 | STEEL | Used for general bonding. Fast, low temperature cure schedule. | 7153 Datasheet | 7153 SDS |
| 7258 | MISMATCHED CTE | Thermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE. | 7258 Datasheet | 7258 SDS |
| 7784 | COPPER | Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C | 7784 Datasheet | 7784 SDS |
| 7784 | DIFFICULT-TO-BOND | Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C | 7784 Datasheet | 7784 SDS |
