Datasheets & SDS

Downloadable Product Details
ProductDescriptionDatasheetSDS
2080Silver filled, general purpose, low volume resistivity with slightly elevated temperature cure. Electrical ground, low volume resistivity. Dispensable through .006\" needle. Low temp. cure.2080 Datasheet2080 SDS
2106Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.2106 Datasheet2106 SDS
2111Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006\" needle. Low temp. cure.2111 Datasheet2111 SDS
2120Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.2120 Datasheet2120 SDS
2121Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.2121 Datasheet2121 SDS
2156A resilient tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion ,low volume resistivity and thermal conductivity.2156 Datasheet2156 SDS
2158A tungsten and silver filled, premixed and frozen epoxy. It provides good adhesion and low volume resistivity with an elevated heat cure.2158 Datasheet2158 SDS
2160Flexible, silver filled, Smart Card Adhesive.2160 Datasheet2160 SDS
2258Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.2258 Datasheet2258 SDS
2485Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.2485 Datasheet2485 SDS
2490Electrically conductive epoxy adhesive for chip bonding. Microelectronic applications, automatic dispensing, screen printing or hand dispense, high Tg 143° C.2490 Datasheet2490 SDS
2900Silver filled, Semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900 Datasheet2900 SDS
2900LVLow viscosity version of the Bondline 2900, silver filled, semiconductor grade die attach epoxy. Ideal for auto dispensing, stamping and screening. Excellent adhesion to copper, silver and gold.2900LV Datasheet2900LV SDS
2920New Ultra Clean Conductive Epoxy! The latest clean epoxy from Bondline. This adhesive has low water extractable ionic contaminates, and a 6 day work life.2920 Datasheet2920 SDS
2948Silver filled die attach adhesive, excellent adhesion to gold and silver surfaces. Dispense small dots for palladium-silver capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.2948 Datasheet2948 SDS
2949Silver filled semiconductor grade die attach epoxy. This smooth consistency adhesive is non-tailing, non-bleeding and non-corrosive and is ideal for auto dispensing, stamping, and screening. Excellent adhesion to copper, silver, and gold surfaces.2949 Datasheet2949 SDS
2990Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.2990 Datasheet2990 SDS
6050Four hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp.6050 Datasheet6050 SDS
6150High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.6150 Datasheet6150 SDS
6165Structural adhesive, high peel strength, good for bonding dissimilar substrate6165 Datasheet6165 SDS
6175Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.6175 Datasheet6175 SDS
6195Filled epoxy system with good properties for humidity and thermal cycling6195 Datasheet6195 SDS
6200Offers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability.6200 Datasheet6200 SDS
6250Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.6250 Datasheet6250 SDS
6275A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.6275 Datasheet6275 SDS
6276A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.6276 Datasheet6276 SDS
6382A stress absorbing, casting epoxy adhesive. Light weight adhesive with a low dielectric constant. Specific gravity 0.61, Tg = 107° C.6382 Datasheet6382 SDS
6460Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.6460 Datasheet6460 SDS
6485Snap cure adhesive - cure 1 min @ 180° C. Microelectronic bonding, ceramic substrate and package sealing.6485 Datasheet6485 SDS
6500Rapid curing adhesive with a strong structural bond6500 Datasheet6500 SDS
6501Low outgassing, fast cure, epoxy adhesive6501 Datasheet6501 SDS
6511Low outgassing, fast cure, filled epoxy adhesive6511 Datasheet6511 SDS
6515Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series6515 Datasheet6515 SDS
6555Low outgassing epoxy adhesive, excellent for bonding semipourous material6555 Datasheet6555 SDS
6560Low viscosity version of Bondline 65556560 Datasheet6560 SDS
6570A translucent, encapsulating epoxy adhesive6570 Datasheet6570 SDS
6571A black version of 65706571 Datasheet6571 SDS
6576A translucent, encapsulating epoxy adhesive6576 Datasheet6576 SDS
6577Medium viscosity encapsulant / sealant, room temperature cure, good impact and thermal shock properties.6577 Datasheet6577 SDS
6640General purpose, room temperature cure epoxy adhesive / Medical grade6640 Datasheet6640 SDS
6680For use in wet coil winding6680 Datasheet6680 SDS
6682Rapid cure at high temperatures, superior high temperature properties6682 Datasheet6682 SDS
6755Low viscosity epoxy, offers high dimensional stability6755 Datasheet6755 SDS
6771Surface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200° C Tg = 154° C6771 Datasheet6771 SDS
6860Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.6860 Datasheet6860 SDS
6875Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.6875 Datasheet6875 SDS
6900Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H.6900 Datasheet6900 SDS
6905Combination underfill and flux for flip chip solder reflow. Solder reflow to 240øC. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C.6905 Datasheet6905 SDS
6959Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C.6959 Datasheet6959 SDS
6968Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.6968 Datasheet6968 SDS
6980Flip chip underfill adhesive6980 Datasheet6980 SDS
7080Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.7080 Datasheet7080 SDS
7081Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.7081 Datasheet7081 SDS
7086Structural adhesive that provides an excellent bond to metal surfaces.7086 Datasheet7086 SDS
7153Used for general bonding. Fast, low temperature cure schedule.7153 Datasheet7153 SDS
7247Low CTE, excellent for bonding and sealing electronic instruments. Low temp. cure for bonding critical electronic instruments. CTE = 18 x 10-6 in/in/° C7247 Datasheet7247 SDS
7247UNFUnfilled version of 7247. Low temp. cure for bonding critical electronic instruments. No weight loss @ 105° C.7247UNF Datasheet7247UNF SDS
7258Thermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE.7258 Datasheet7258 SDS
7352Structural Adhesive, for difficult-to-bond materials. Long work life.7352 Datasheet7352 SDS
7780Moisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing.7780 Datasheet7780 SDS
7784Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C7784 Datasheet7784 SDS