Film Adhesives

General Instructions for Film Storage and Use

IMPORTANT DOCUMENT – FORWARD TO PRODUCTION LEAD!

General Terms and Definitions:

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Bondline Film Adhesives:

Epoxy based, B staged, glass fiber supported adhesive.
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Availability:

Substrate Attach, Lid Seal, Heat Sink Bonding, Electrical Shielding, Electrical Grounding and Temporary Bonds.

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Thickness:

4 – 8 mils (.004″ – .008″) thick. Types: Thermally conductive, Electrically conductive, Temporary Thermoplastic and Dielectric films.

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Applications:

Substrate Attach, Lid Seal, Heat Sink Bonding, Electrical Shielding, Electrical Grounding and Temporary Bonds.

FROZEN STORAGE

Film adhesive must be stored at 5°C/-40°C or colder at all times (depending on the type of film), refer to data sheet for storage requirements. Storing this film adhesive at temperatures warmer than 5°C/-40°C may alter the adhesives properties and shorten its work life. DO NOT RE-FREEZE film adhesive that has already been thawed!

THAWING AND HANDLING
Remove backing paper from die cut preforms only after the film has reached room temperature.
SURFACE PREPARATION
Make sure that all surface areas to be bonded are free of contamination. If parts have been solvent cleaned make sure solvent is dried before applying film adhesive.
APPLICATION
Place die cut film adhesive between cleaned parts. Apply continuous pressure of 1-20 psi during cure to avoid air pockets or voiding between adherents. Use dead weight or spring clamps. Adhesion squeeze out can be controlled by reducing clamping pressure, reducing preform thickness or cutting back the preform size by .002″ – .003″.
CURE
Choose a Cure Option (time & temperature) from the Bondfilm Technical Data Sheet. Preheat the oven to the temperature of the selected cure option. For optimum cure, do not deviate from the selected cure schedule. Be sure to allow additional time for holding fixtures to reach cure temperature. Avoid opening oven doors during cure. Large fixtures and/or multiple fixtures may require extended cure time.
Non-weight Bonding:
In some cases, pressure bonding is not possible. Therefore, one recommended procedure is to place the adherends , with the film adhesive (liners removed) between them , on a hot plate for 1 to 2 minutes, until the adhesive film becomes tacky or slightly melted. Scrub the two adherends together in a back and forth motion, until intimate contact occurs (Co-planer alignment) and air is removed from the adhesive bondline. Put into a box oven to fully cure (preferably a convection box oven).
SAFETY

Review the adhesive Material Safety Data Sheet (MSDS) before using. Refer to the MSDS in case of emergency. Always wear protective gloves and goggles while handling adhesives. Only work with adhesives in well-ventilated areas, with curing ovens vented to the outside. Bondline adhesives are for industrial use only.

For recommendations and help with any aspect of adhesive applications please contact the Bondline Technical Service Department (408) 830-9200.

Email Bondline Technical Service Department