| Product #
|
Description
|
DATASHEET
|
MSDS
|
| 2072 |
Silver
filled, snap cure, low outgassing epoxy adhesive. Electrical
ground, low volume resistivity. Rapid cure 5min @ 125°C. Low
temp. cure 20min @ 65°C. |
2072
|
2072-MSDS
|
| 2080 |
Silver
filled, general purpose, low volume resistivity with slightly
elevated temperature cure. Electrical ground, low volume resistivity.
Dispensable through .006" needle. Low temp. cure. |
2080
|
2080-MSDS
|
| 2106 |
Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C. |
2106
|
2106-MSDS
|
| 2111 |
Flexible
electrically conductive epoxy adhesive. Very low stress with
low volume resistivity. Excellent adhesion to gold, silver,
stainless and copper. Dispensable through .006" needle. Low
temp. cure. |
2111
|
2111-MSDS
|
| 2120 |
Silver
filled, low viscosity, room temperature cure epoxy adhesive.
Electrical grounding, recording heads, quick cure. Low volume
resistivity, room temperature cure options. |
2120
|
2120-MSDS
|
| 2121 |
Silver
filled, low viscosity, room temperature cure epoxy adhesive/
Medical Grade. Electrical ground, quick, low temp cure. Vacuum
degassed, excellent dispensability. |
2121
|
2121-MSDS
|
| 2156 |
A tungsten and silver filled, premixed and frozen epoxy. It
provides good adhesion and low volume resistivity with an elevated heat
cure. |
2156
|
2156-MSDS
|
| 2160 |
Flexible,
silver filled, Smart Card Adhesive. |
2160
|
2160-MSDS
|
| 2258 |
Flexible,
silver filled epoxy for Bonding chips to substrate with mismatch
in CTE. Great for die sizes greater than .400 sq. in to flex-circuit
miniature LCD display. Semiconductor Grade. |
2258
|
2258-MSDS
|
| 2485 |
Silver
filled, snap cure adhesive, microelectronic chip bonding,
automatic dispensing. Quick cure. 10 day work life, low volume
resistivity, 2.57 w/mK - Thermal Conductivity. |
2485
|
2485-MSDS
|
| 2490 |
Electrically
conductive epoxy adhesive for chip bonding. Microelectronic
applications, automatic dispensing, screen printing or hand
dispense, high Tg 143°C. |
2490
|
2490-MSDS
|
| 2900 |
Silver
filled, Semiconductor grade die attach epoxy. Ideal for auto
dispensing, stamping and screening. Excellent adhesion to
copper, silver and gold. |
2900
|
2900-MSDS
|
| 2900LV
|
Low
viscosity version of the Bondline 2900, silver filled, semiconductor
grade die attach epoxy. Ideal for auto dispensing, stamping
and screening. Excellent adhesion to copper, silver and gold.
|
2900LV
|
2900LV-MSDS
|
| 2920 |
New
Ultra Clean Conductive Epoxy! The latest clean epoxy from
Bondline. This adhesive has low water extractable ionic contaminates,
and a 6 day work life. |
2920
|
2920-MSDS
|
| 2948 |
Silver
filled die attach adhesive, excellent adhesion to gold and
silver surfaces. Dispense small dots for palladium-silver
capacitor attach. Passed 1000 hrs at 95% R.H., no epoxy bleed.
|
2948
|
2948-MSDS
|
| 2990 |
Die
attach adhesive with low mobile ions, used for automated die
attach. Snap cure option. Excellent adhesion to copper, silver
and gold. Moisture resistant. |
2990
|
2990-MSDS
|
| 6050 |
Four
hour room temperature cure epoxy adhesive. Used in LCD, HGA.
Fast cure options 3 min @ 95°C or 4 hrs @ room temp. |
6050
|
6050-MSDS
|
| 6150 |
High
strength, low viscosity structural epoxy adhesive. Used in
magnetic heads, glass structural bonds. It has high peel strength
with microdimentional stability. |
6150
|
6150-MSDS
|
| 6158 |
Flexible,
dielectric, semiconductor grade adhesive. Low stress, 8 hr
work life, low extractable ions. |
6158
|
6158-MSDS
|
| 6165 |
Structural
adhesive, high peel strength, good for bonding dissimilar
substrate |
6165
|
6165-MSDS
|
| 6175 |
Non-flowing,
high peel strength structural epoxy adhesive, used in magnetic
heads. Minimal moisture absorption, good for bonding dissimilar
substrates. High peel strength, room temp. cure options. |
6175
|
6175-MSDS
|
| 6195 |
Filled
epoxy system with good properties for humidity and thermal
cycling |
6195
|
6195-MSDS
|
| 6200 |
Offers
good adhesion when exposed to humidity and thermal cycling.
Used in probe card applications. Minimal moisture absorption.
High dimensional stability. |
6200
|
6200-MSDS
|
| 6250 |
Semi-flexible
epoxy adhesive for bonding dissimilar materials. No-flow during
cure, excellent for bonding rubber, metal and most plastics.
Suitable for bonding material with mismatched CTE. |
6250
|
-
|
| 6275 |
A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion. |
6275
|
6275-MSDS
|
| 6276 |
A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion. |
6276
|
6276-MSDS
|
| 6350 |
Room
temperature curing, casting epoxy adhesive. |
6350
|
6350-MSDS
|
| 6382 |
A
stress absorbing, casting epoxy adhesive. Light weight adhesive
with a low dielectric constant. Specific gravity 0.61, Tg
= 107°C. |
6382
|
6382-MSDS
|
| 6400 |
Encapsulating
adhesive, capable of bonding to many surfaces. Bonds well
to glass, ferrite, aluminum and steel. Tg = 99°C, low weight
loss. |
6400
|
6400-MSDS
|
| 6407 |
Filled
system with good properties for humidity and thermal cycling,
high dimensional stability. Thick paste. |
6407
|
6407-MSDS
|
| 6460 |
Ultra-low
viscosity epoxy adhesive. Used in magnetic devices. Bonds
well to glass, ferrite, Aluminum and steel. Low viscosity
- 250 cps, high capillary properties. |
6460
|
6460-MSDS
|
| 6470 |
High
dimensional stability when bonding ferrite to ceramic. Good
resistance to humidity. |
6470
|
6470-MSDS
|
| 6485 |
Snap
cure adhesive - cure 1 min @ 180°C. Microelectronic bonding,
ceramic substrate and package sealing. |
6485
|
6485-MSDS
|
| 6500 |
Rapid
curing adhesive with a strong structural bond |
6500
|
6500-MSDS
|
| 6501 |
Low
outgassing, fast cure, epoxy adhesive |
6501
|
6501-MSDS
|
| 6511 |
Low
outgassing, fast cure, filled epoxy adhesive |
6511
|
6511-MSDS
|
| 6515 |
Low
outgassing epoxy adhesive, controlled flow version of Bondline
6500 series |
6515
|
6515-MSDS
|
| 6555 |
Low
outgassing epoxy adhesive, excellent for bonding semipourous
material |
6555
|
6555-MSDS
|
| 6560 |
Low
viscosity version of Bondline 6555 |
6560
|
6560-MSDS
|
| 6570 |
A
translucent, encapsulating epoxy adhesive |
6570
|
6570-MSDS
|
| 6571 |
A
black version of 6570 |
6571
|
6571-MSDS
|
| 6577 |
Medium
viscosity encapsulant / sealant, room temperature cure, good
impact and thermal shock properties. |
6577
|
6577-MSDS
|
| 6640 |
General
purpose, room temperature cure epoxy adhesive / Medical grade
|
6640
|
6640-MSDS
|
| 6680 |
For
use in wet coil winding |
6680
|
6680-MSDS
|
| 6682 |
Rapid
cure at high temperatures, superior high temperature properties
|
6882
|
6682-MSDS
|
| 6755 |
Low
viscosity epoxy, offers high dimensional stability |
6755
|
6755-MSDS
|
| 6770 |
Dielectric
epoxy adhesive formulated for attaching surface mounted devices
to PC boards prior to wave solder. |
6770
|
6770-MSDS
|
| 6771 |
Surface
mount adhesive for pc boards. Good for attaching surface mounted
devices to PC boards prior to wave solder. High temp cure
10 seconds @ 200°C Tg = 154°C |
6771
|
6771-MSDS
|
| 6860 |
Lowest
viscosity polyurethane adhesive. A damping adhesive for voice
coil applications and medical devices. Flowable resilient
adhesive. Unfilled version of 6875. Class VI biocompatibility.
|
6860
|
6860-MSDS
|
| 6875 |
Low
outgassing, medium viscosity polyurethane adhesive/ Medical
grade. A damping adhesive for voice coil applications and
medical devices. Excellent adhesion to Aluminum, copper, rubber,
nylon and steel. A resilient adhesive. |
6875
|
6875-MSDS
|
| 6900 |
Low
viscosity semiconductor grade adhesive, low mobile ions, excellent
bond to glass, ceramic, ferrite and gold. Thin bondlines to
2 microns. Used in tape head applications. Passed 96 hours
@ 60°C / 80% R.H. |
6900
|
6900-MSDS
|
| 6905 |
Combination
underfill and flux for flip chip solder reflow. Solder reflow
to 240°C. Flux and encapsulant. Epoxy gels in 30 seconds @
240°C. |
6905
|
6905-MSDS
|
| 6959 |
Dielectric,
Semiconductor grade, non-tailing, non-bleeding, non-corrosive
adhesive. Snap cure, low viscosity encapsulant for dam and
fill applications. Cure 1 min @ 175°C. |
6959
|
6959-MSDS
|
| 6968 |
Dielectric,
Semiconductor grade, non-tailing, non-bleeding, non-corrosive
adhesive. Snap cure, low viscosity encapsulant for dam and
fill applications. Cure 1 min @ 175°C. Low ionic, no epoxy
bleed. |
6968
|
6968-MSDS
|
| 6980 |
Flip
chip underfill adhesive |
6980
|
6980-MSDS
|
| 7080 |
Bondline
7080 is a thermally conductive epoxy adhesive that provides
strong bonds to such as gold, silver, copper, brass and solder.
|
7080
|
7080-MSDS
|
| 7081 |
Bondline 7081 is a thermally conductive epoxy
adhesive that provides strong bonds to metals,
such as gold, silver, copper, brass and solder.
|
7081
|
7081-MSDS
|
| 7086 |
Structural
adhesive that provides an excellent bond to metal surfaces.
|
7086
|
7086-MSDS
|
| 7153 |
Used
for general bonding. Fast, low temperature cure schedule |
7153
|
-
|
| 7247 |
Low
CTE, excellent for bonding and sealing electronic instruments.
Low temp. cure for bonding critical electronic instruments.
CTE = 18 x 10-6 in/in/°C |
7247
|
7247-MSDS
|
| 7247unf |
Unfilled
version of 7247. Low temp. cure for bonding critical electronic
instruments. No weight loss @ 105°C. |
7247UNF
|
7247UNF-MSDS
|
| 7258 |
Thermally
conductive, flexible, semiconductor grade, good for bonding
substrate with mismatched CTE. |
7258
|
7258-MSDS
|
| 7352 |
Structural
Adhesive, for difficult-to-bond materials. Long work life.
|
7352
|
-
|
| 7780 |
Moisture
resistant epoxy adhesive with a 2 week work life. Used for
Encapsulating, substrate attach and lid sealing. |
7780
|
7780-MSDS
|
| 7784 |
Thermally
conductive, moisture resistant epoxy adhesive with a 2 week
work life. Used for encapsulating, substrate attach, heat
sink and lid sealing. Tg=130°C |
7784
|
7784-MSDS
|
| 7794 |
Thermally
conductive adhesive designed for difficult to bond materials.
|
7794
|
-
|
| 7990 |
Chip
scale underfill encapsulant, 1 mil gap. Low mobile ions. Long
work life. |
7990
|
-
|
| 7995 |
Glob
top adhesive. Chip-on-board encapsulant. High purity. Maximum
moisture resistance. Low mobile ions, Tg=132°C |
7995
|
-
|
