HIGH TEMPERATURE RESISTANT

Part #
Description
DATASHEET
MSDS
2485 Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.
2485
2485-MSDS
6682 Rapid cure at high temperatures, superior high temperature properties
6682
6682-MSDS
6770 Dielectric epoxy adhesive formulated for attaching surface mounted devices to PC boards prior to wave solder.
6770
6770-MSDS
6771 Surface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200°C Tg = 154°C
6771
6771-MSDS
6905 Combination underfill and flux for flip chip solder reflow. Solder reflow to 240°C. Flux and encapsulant. Epoxy gels in 30 seconds @ 240°C.
6905
6905-MSDS
7352 Structural Adhesive, for difficult-to-bond materials. Long work life.
7352
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7784 Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130°C
7784
7784-MSDS