WITHSTAND HIGH HUMIDITY AND THERMAL CYCLING

Part #
Description
DATASHEET
MSDS
6150 High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.
6150
6150-MSDS
6175 Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.
6175
6175-MSDS
6195 Filled epoxy system with good properties for humidity and thermal cycling
6195
6195-MSDS
6200 Offers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability.
6200
6200-MSDS
6900 Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60°C / 80% R.H.
6900
6900-MSDS
7780 Moisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing.
7780
7780-MSDS