LOW OUTGASSING

Part #
Description
DATASHEET
MSDS
2072 Silver filled, snap cure, low outgassing epoxy adhesive. Electrical ground, low volume resistivity. Rapid cure 5min @ 125°C. Low temp. cure 20min @ 65°C.
2072
2072-MSDS
6501 Low outgassing, fast cure, epoxy adhesive
6501
6501-MSDS
6511 Low outgassing, fast cure, filled epoxy adhesive
6511
6511-MSDS
6515 Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series
6515
6515-MSDS
6555 Low outgassing epoxy adhesive, excellent for bonding semipourous material
6555
655-MSDS