SNAP CURE / RAPID CURE

Part #
Description
DATASHEET
MSDS
2072 Silver filled, snap cure, low outgassing epoxy adhesive. Electrical ground, low volume resistivity. Rapid cure 5min @ 125°C. Low temp. cure 20min @ 65°C.
2072
2072-MSDS
2120 Silver filled, low viscosity, room temperature cure epoxy adhesive. Electrical grounding, recording heads, quick cure. Low volume resistivity, room temperature cure options.
2120
2120-MSDS
2121 Silver filled, low viscosity, room temperature cure epoxy adhesive/ Medical Grade. Electrical ground, quick, low temp cure. Vacuum degassed, excellent dispensability.
2121
2121-MSDS
2485 Silver filled, snap cure adhesive, microelectronic chip bonding, automatic dispensing. Quick cure. 10 day work life, low volume resistivity, 2.57 w/mK - Thermal Conductivity.
2485
2485-MSDS
2990 Die attach adhesive with low mobile ions, used for automated die attach. Snap cure option. Excellent adhesion to copper, silver and gold. Moisture resistant.
2990
2990-MSDS
6050 Four hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95°C or 4 hrs @ room temp.
6050
6050-MSDS
6485 Snap cure adhesive - cure 1 min @ 180°C. Microelectronic bonding, ceramic substrate and package sealing.
6485
6485-MSDS
6500 Rapid curing adhesive with a strong structural bond
6500
6500-MSDS
6501 Low outgassing, fast cure, epoxy adhesive
6501
6501-MSDS
6511 Low outgassing, fast cure, filled epoxy adhesive
6511
6511-MSDS
6515 Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series
6515
6515-MSDS
6682 Rapid cure at high temperatures, superior high temperature properties
6682
6682-MSDS
6959 Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175°C.
6959
6959-MSDS
6968 Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175°C. Low ionic, no epoxy bleed.
6869
6968-MSDS
7153 Used for general bonding. Fast, low temperature cure schedule
7153
-