ALUMINUM

Part #
Description
DATASHEET
MSDS
6250 Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.
6250
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6460 Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.
6460
6460-MSDS
6500 Rapid curing adhesive with a strong structural bond
6500
6500-MSDS
7153 Used for general bonding. Fast, low temperature cure schedule
7153
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