CERAMIC

Part #
Description
DATASHEET
MSDS
6250 Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.
6250
-
6407 Filled system with good properties for humidity and thermal cycling, high dimensional stability. Thick paste.
6407
6407-MSDS
6900 Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60°C / 80% R.H.
6900
6900-MSDS
7355 Structural epoxy adhesive, good for sealing ceramic packages. Ceramic substrate attach. Excellent adhesion to gold, silver and copper. Tg=130°C.
7355
-