GLASS

Part #
Description
DATASHEET
MSDS
6460 Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.
6460
6460-MSDS
6500 Rapid curing adhesive with a strong structural bond
6500
6500-MSDS
6501 Low outgassing, fast cure, epoxy adhesive
6501
6501
6511 Low outgassing, fast cure, filled epoxy adhesive
6511
6511-MSDS
6515 Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series
6515
6515-MSDS
6900 Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60°C / 80% R.H.
6900
6900-MSDS
7153 Used for general bonding. Fast, low temperature cure schedule
7153
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