MISMATCHED CTE

Part #
Description
DATASHEET
MSDS
2106 Flexible, silver filled epoxy. Provides excellent adhesion to difficult to bond materials like lead, gold, silver and stainless steel. Offers good adhesion at temperatures as low as -195° C.
2106
2106-MSDS
2111 Flexible electrically conductive epoxy adhesive. Very low stress with low volume resistivity. Excellent adhesion to gold, silver, stainless and copper. Dispensable through .006" needle. Low temp. cure.
2111
2111-MSDS
2160 Flexible, silver filled, Smart Card Adhesive.
2160
2160-MSDS
2258 Flexible, silver filled epoxy for Bonding chips to substrate with mismatch in CTE. Great for die sizes greater than .400 sq. in to flex-circuit miniature LCD display. Semiconductor Grade.
2258
2258-MSDS
6250 Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.
6250
-
6275 A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.
6275
-
6276 A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.
6276
-6276-MSDS
7258 Thermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE.
7258
-7258-MSDS