Testing Capabilities

Every adhesive component that enters our factory must pass an incoming inspection.
Every lot of adhesive that leaves our factory has undergone a comprehensive final inspection per customer or Bondline spec. Every shipment of Bondline Adhesives is accompanied by a Certificate of Compliance (C of C), guaranteeing its quality.
TEST METHODS BASED ON
Volume Resistivity VR-4 Method of testing electrically conductive materials VR-4 ASTM D 257-91
Viscosity Measurement VM-1 Method of testing viscosity of materials VM-1 ASTM D 1084-88
Viscosity Measurement VM-2 Method of testing viscosity using Cone and Plate VM-2 ASTM D 3205-86
Extrusion Measurement EXM-1 Method of testing viscosity of materials EXM-1 ASTM D 1183-91
Tensile Lap-Shear LS-2 Method of testing lap shear strength of materials LS-2 ASTM D 1002-94
Hardness Measurement HM-1 Method of testing the hardness of materials HM-1 ASTM D 2240

 

Analytical Capabilities at Bondline Electronic Adhesives

  • Thermal Analyzers Differential Scanning Calorimeter (DSC) – It is an instrument that measures the exothermic and endothermic reactions, and heat capacity of materials. The glass transition (Tg) and the degree of cure of our adhesives are routinely determined using the DSC.
  • Thermal Gravimetric Analyzer (TGA) – It is an instrument that measures the weight change while the material is heated or cooled at a constant rate. The weight loss of our adhesives at 105°C and 300C are routinely determined using the TGA.
  • Thermal Mechanical Analyzer (TMA) – It is an instrument that measures the materials behavior, expansion and/or contraction, as function of an applied load or temperature. The coefficient of thermal expansion (CTE) of our adhesives before and after Tg are routinely determined using the TMA.
  • Ion Chromatograph (IC) IC is a chromatography instrument that measures ionic contaminants in a material. The levels of mobile ions such as fluoride, chloride, sodium and potassium in our adhesives are routinely determined using the IC.
  • Instron Instron is an instrument that measures the mechanical strength of materials when a load is applied at ambient, elevated or sub-ambient temperatures. The lap shear and peel strength of our adhesives are routinely determined using the Instron.
  • Viscometers (Brookfield) Viscometer is an instrument that measures the material resistance to flow at a specified temperature. The consistency of our paste adhesive is routinely determined using the cone and plate viscometer.
  • Die Shear Tester ( Royce System 552) Die shear tester is an instrument that measure the shear strength of adhesives that bond the integrated circuit (silicon chip) to a substrate or leadframe. Typically, the values are expressed in grams per square inch.