Bondline 7080 is a thermally conductive epoxy adhesive that provides strong bonds to such as gold, silver, copper, brass and solder.
Bondline 7081 is a thermally conductive epoxy adhesive that provides strong bonds to metals, such as gold, silver, copper, brass and solder.
Structural adhesive that provides an excellent bond to metal surfaces.
Used for general bonding. Fast, low temperature cure schedule.
Low CTE, excellent for bonding and sealing electronic instruments. Low temp. cure for bonding critical electronic instruments. CTE = 18 x 10-6 in/in/° C
Unfilled version of 7247. Low temp. cure for bonding critical electronic instruments. No weight loss @ 105° C.
Thermally conductive, flexible, semiconductor grade, good for bonding substrate with mismatched CTE.
Structural Adhesive, for difficult-to-bond materials. Long work life.
Moisture resistant epoxy adhesive with a 2 week work life. Used for Encapsulating, substrate attach and lid sealing.
Thermally conductive, moisture resistant epoxy adhesive with a 2 week work life. Used for encapsulating, substrate attach, heat sink and lid sealing. Tg=130° C
An unsupported silver filled epoxy adhesive film that is electrically conductive in x, y and z axis.
Flexible, thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.
Thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.
Silver filled, conductive film adhesive. Good for Sheilding and Heat Sink Attach. no squeeze out with a low temperature cure.
Low temperature curing epoxy film adhesive. Good choice for substrate attachments.
