Four hour room temperature cure epoxy adhesive. Used in LCD, HGA. Fast cure options 3 min @ 95° C or 4 hrs @ room temp.
High strength, low viscosity structural epoxy adhesive. Used in magnetic heads, glass structural bonds. It has high peel strength with microdimentional stability.
Non-flowing, high peel strength structural epoxy adhesive, used in magnetic heads. Minimal moisture absorption, good for bonding dissimilar substrates. High peel strength, room temp. cure options.
Offers good adhesion when exposed to humidity and thermal cycling. Used in probe card applications. Minimal moisture absorption. High dimensional stability.
Semi-flexible epoxy adhesive for bonding dissimilar materials. No-flow during cure, excellent for bonding rubber, metal and most plastics. Suitable for bonding material with mismatched CTE.
A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.
A resilient epoxy paste. This room temperature curing adhesive is excellent for bonding rubber, metal and most plastics. It is particularly suitable for bonding material with mismatched coefficient of thermal expansion.
A stress absorbing, casting epoxy adhesive. Light weight adhesive with a low dielectric constant. Specific gravity 0.61, Tg = 107° C.
Ultra-low viscosity epoxy adhesive. Used in magnetic devices. Bonds well to glass, ferrite, Aluminum and steel. Low viscosity - 250 cps, high capillary properties.
Snap cure adhesive - cure 1 min @ 180° C. Microelectronic bonding, ceramic substrate and package sealing.
Rapid curing adhesive with a strong structural bond
Low outgassing, fast cure, filled epoxy adhesive
Low outgassing epoxy adhesive, controlled flow version of Bondline 6500 series
Low outgassing epoxy adhesive, excellent for bonding semipourous material
An unsupported silver filled epoxy adhesive film that is electrically conductive in x, y and z axis.
Flexible, thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.
Thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.
Silver filled, conductive film adhesive. Good for Sheilding and Heat Sink Attach. no squeeze out with a low temperature cure.
Low temperature curing epoxy film adhesive. Good choice for substrate attachments.
