A translucent, encapsulating epoxy adhesive. Good for SPO2.
Medium viscosity encapsulant / sealant, room temperature cure, good impact and thermal shock properties.
General purpose, room temperature cure epoxy adhesive / Medical grade
Rapid cure at high temperatures, superior high temperature properties
Surface mount adhesive for pc boards. Good for attaching surface mounted devices to PC boards prior to wave solder. High temp cure 10 seconds @ 200° C Tg = 154° C
Lowest viscosity polyurethane adhesive. A damping adhesive for voice coil applications and medical devices. Flowable resilient adhesive. Unfilled version of 6875. Class VI biocompatibility.
Low outgassing, medium viscosity polyurethane adhesive/ Medical grade. A damping adhesive for voice coil applications and medical devices. Excellent adhesion to Aluminum, copper, rubber, nylon and steel. A resilient adhesive.
Low viscosity semiconductor grade adhesive, low mobile ions, excellent bond to glass, ceramic, ferrite and gold. Thin bondlines to 2 microns. Used in tape head applications. Passed 96 hours @ 60° C / 80% R.H.
Combination underfill and flux for flip chip solder reflow. Solder reflow to 240øC. Flux and encapsulant. Epoxy gels in 30 seconds @ 240° C.
Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C.
Dielectric, Semiconductor grade, non-tailing, non-bleeding, non-corrosive adhesive. Snap cure, low viscosity encapsulant for dam and fill applications. Cure 1 min @ 175° C. Low ionic, no epoxy bleed.
An unsupported silver filled epoxy adhesive film that is electrically conductive in x, y and z axis.
Flexible, thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.
Thermally conductive film, formulated to bond materials with mismatched coefficients of thermal expansion. Low temperature cure.
Silver filled, conductive film adhesive. Good for Sheilding and Heat Sink Attach. no squeeze out with a low temperature cure.
Low temperature curing epoxy film adhesive. Good choice for substrate attachments.
